Qualcomm Selects TSMC and Samsung OEM to Meet the Supply

Industry insiders pointed out that when the order is transferred to TSMC, the mask needs to be redesigned, and the lead time may be more than half a year. The 5nm chip transferred to TSMC is expected to be shipped in the second half of next year.

Generally speaking, for strategic considerations, Qualcomm dispersed its products to TSMC, Samsung and other wafer factories for production. Previously, it was reported that the contract orders of Xiaolong 875 and X60 were won by TSMC, but in the end, Qualcomm still looked for Samsung.

At present, TSMC's 5nm process capacity is full. In the third quarter, some capacity is used to produce Hisilicon chips, while most of the capacity is reserved for apple and almost all of it is included by apple in the fourth quarter. In the first quarter of next year, in addition to apple, some amd chips will also be produced. TSMC's 5nm process capacity is planning to continue to expand. The current monthly capacity is about 60000 pieces, which is expected to expand to 80000-90000 pieces in the second quarter of next year, so as to undertake more orders.

Qualcomm's next-generation 5g modem chip X60 and high-end 5g mobile phone chip snapdragon 875 are expected to be put into production in the 5nm process in Samsung wafer foundry in the second half of this year. However, it was reported on the 4th that Qualcomm will switch 5nm chips to TSMC due to the consideration of capacity configuration. Among them, all X60 chips will be handed over to TSMC for 5nm mass production, The snapdragon 875 may maintain the simultaneous production of chips on both sides, such as TSMC and Samsung wafer foundry. TSMC does not comment on market rumors and customer orders; Qualcomm also does not comment on market rumors.

Qualcomm said that based on commercial considerations, it chose to be manufactured by two manufacturers, mainly in the hope of sufficient supply.